RF/Microwave Component Housings & Sweat Solder Bonding

Along with many years of knowledge and expertise in machining complex RF/Microwave Component Housings and RF/Microwave Carrier Plates, PCR Technologies, Inc. has developed the next generation in RF/Microwave Circuit bonding applications, the "Selective Solder Bonding" (SSB™) method. This cost effective, proprietary (SSB™) method, produces superior and consistent quality by means of our highly efficient production techniques utilizing sweat solder bonding.

Unlike metal-backed, Duriod® products, which require special plating for plated-through-holes or the antiquated and labor-intensive Hot-Plate process, PCR Technologies' (SSB™) method provides a uniform and virtually "void-free" sweat solder bond, yielding high repeatability without discoloration and minimal solder flow onto the PCB's plated-through-holes and edges.